2134/9122624.v1
Alkaios Bournias-Varotsis
Alkaios
Bournias-Varotsis
Xiaoxiao Han
Xiaoxiao
Han
Russell A Harris
Russell A
Harris
Daniel Engstrom
Daniel
Engstrom
Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics
Loughborough University
2019
Uncategorised value
2019-08-06 09:08:50
Journal contribution
https://repository.lboro.ac.uk/articles/journal_contribution/Ultrasonic_additive_manufacturing_using_feedstock_with_build-in_circuitry_for_3D_metal_embedded_electronics/9122624
Embedded electronics and sensors are becoming increasingly important for the
development of Industry 4.0. For small components, space constraints lead to full 3D
integration requirements that are only achievable through Additive Manufacturing.
Manufacturing metal components usually require high temperatures incompatible with
electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with
mechanical properties close to bulk, but with the integration of internal embedded electronics,
sensors or optics. This paper describes a novel manufacturing route for embedding
electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors
and insulators were prepared separately from the UAM process thereby separating the
electronics preparation from the part consolidation. A dual material polymer layer exhibited
the best electrically insulating properties, while providing mechanical protection of printed
conductive tracks stable up to 100°C. General design and UAM process recommendations
are given for 3D embedded electronics in a metal matrix.