2134/37384
Bo Yuan
Bo
Yuan
Christopher Harvey
Christopher
Harvey
Gary W. Critchlow
Gary W.
Critchlow
Rachel Thomson
Rachel
Thomson
Simon Wang
Simon
Wang
Determination of residual stress and interface adhesion toughness of thin films by blisters
Loughborough University
2019
Thin film
Residual stress
Fracture toughness
Spalling fracture
Adhesion strength
Engineering not elsewhere classified
2019-04-01 10:14:29
Journal contribution
https://repository.lboro.ac.uk/articles/journal_contribution/Determination_of_residual_stress_and_interface_adhesion_toughness_of_thin_films_by_blisters/9228836
Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films
under constant bi-axial compressive residual stress. In this work, new mechanical models are
used in conjunction with measurements of blister morphology parameters to determine the
residual stress in films and the adhesion toughness at interfaces. These new models are based
on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and
growth of blisters instead of buckling, as in the conventional models, since the thin films are
under constant compressive residual stress. Predictions from the models are in excellent
agreement with independent experimental data.