2134/36948
Zhaoxia Zhou
Zhaoxia
Zhou
Li Liu
Li
Liu
Changqing Liu
Changqing
Liu
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
Loughborough University
2019
Thermal stability
High temperature Pb-free solder
Zn-Al solder
Interconnect
In-situ electron microscopy
Mechanical Engineering not elsewhere classified
2019-02-22 09:45:52
Conference contribution
https://repository.lboro.ac.uk/articles/conference_contribution/Thermal_stability_of_high_temperature_Pb-free_solder_interconnect_characterised_by_in-situ_electron_microscopy/9233786
The present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during heating. In addition, stress building up was evidenced by the progressive evolving of the dislocations at the interface between NiW-P interlayer and the ZnAl Solder. However, due to the μm to nm scale of specimens' dimensions required for electron microscopy, the sample preparation and data interpretation remains a challenge.