Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging
Jing Wang
Zhaoxia Zhou
Wen-Feng Lin
Changqing Liu
Behzad Ahmadi
Lee Empringham
2134/38261
https://repository.lboro.ac.uk/articles/conference_contribution/Copper-based_graphene_nanoplatelet_composites_as_interconnect_for_power_electronics_pacakging/9240422
© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm 2 , there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts.
2019-07-09 11:07:25
Power electronic systems packaging
Heterogeneous integration
Composite electrodeposition
Cu electroplating
Mechanical Engineering not elsewhere classified