2134/17072 Ying Lim Ying Lim Yee Goh Yee Goh Hiroki Tsuda Hiroki Tsuda Jun Akedo Jun Akedo Masahiro Aoyagi Masahiro Aoyagi Changqing Liu Changqing Liu Adhesion of aerosol deposition traces targeted for flexible electronics applications Loughborough University 2015 untagged Mechanical Engineering not elsewhere classified 2015-03-20 16:00:32 Conference contribution https://repository.lboro.ac.uk/articles/conference_contribution/Adhesion_of_aerosol_deposition_traces_targeted_for_flexible_electronics_applications/9556637 •Emergence of wearable electronics - from medical to consumer products. •Requirement: To realise conductive traces on flexible substrates. •Common printing techniques: screen printing and inkjet printing. •Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition. •From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates. •Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).