2134/17072
Ying Lim
Ying
Lim
Yee Goh
Yee
Goh
Hiroki Tsuda
Hiroki
Tsuda
Jun Akedo
Jun
Akedo
Masahiro Aoyagi
Masahiro
Aoyagi
Changqing Liu
Changqing
Liu
Adhesion of aerosol deposition traces targeted for flexible electronics applications
Loughborough University
2015
untagged
Mechanical Engineering not elsewhere classified
2015-03-20 16:00:32
Conference contribution
https://repository.lboro.ac.uk/articles/conference_contribution/Adhesion_of_aerosol_deposition_traces_targeted_for_flexible_electronics_applications/9556637
•Emergence of wearable electronics - from medical to consumer products.
•Requirement: To realise conductive traces on flexible substrates.
•Common printing techniques: screen printing and inkjet printing.
•Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition.
•From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates.
•Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).