2134/3930
Samjid H. Mannan
Samjid H.
Mannan
David Hutt
David
Hutt
David Whalley
David
Whalley
Paul Conway
Paul
Conway
Observations of solder paste reflow by means of electrical measurements
Loughborough University
2008
untagged
Mechanical Engineering not elsewhere classified
2008-11-07 16:59:54
Online resource
https://repository.lboro.ac.uk/articles/online_resource/Observations_of_solder_paste_reflow_by_means_of_electrical_measurements/9558629
This paper presents a method for exploring the changes
occurring at the surfaces of solder particles during the reflow
soldering process. The method involves measuring changes in
electrical resistance of a sample of paste as a function of test
voltage. The results are used to estimate the size and nature of
electrical contact spots between the particles, and how these
depend on temperature and time. The activation energy of the
process responsible for increasing the size of contact spots is
deduced for RA and RMA type fluxes and it is shown that
sintering is not the dominant mechanism for increasing contact
size. These results, together with a programme of CFD studies
are expected to help improve solder paste formulations.