2134/4213
Jianfeng Li
Jianfeng
Li
Farhad Sarvar
Farhad
Sarvar
David Whalley
David
Whalley
David Hutt
David
Hutt
Mike P. Clode
Mike P.
Clode
Samjid H. Mannan
Samjid H.
Mannan
Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system
Loughborough University
2009
untagged
Mechanical Engineering not elsewhere classified
2009-02-11 16:02:53
Conference contribution
https://repository.lboro.ac.uk/articles/conference_contribution/Failure_mechanisms_of_dummy_IGBT_assembles_constructed_using_liquid_in-Sn_Nb_system/9559538
Liquid solder joints have previously been proposed in
order to improve the reliability of solder joints in general, and
especially for those that are operated at elevated temperatures.
The solder is designed to melt during high temperature
operation, releasing the stresses on the joint. The component
will remain mechanically attached to the substrate by use of a
polymer underfill or glob-top. Assemblies of dummy insulated
gate bipolar transistor (IGBT) devices were constructed using
the In-Sn as a low melting point solder and Nb as a barrier
layer, on both device bond pads and connecting wires.
Silicone and epoxy based adhesives were used as glob top
materials, and alumina was used as the substrate. Thermal
cycling carried out between -20 and +125 °C lead to rapid
joint failure, and analysis of the joints showed that the wires
had moved under mechanical tests. Further testing is
underway.