2134/7129
Stephen Ebbens
Stephen
Ebbens
David Hutt
David
Hutt
Changqing Liu
Changqing
Liu
The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications
Loughborough University
2010
Copper
Fluxless-soldering
Oxidation
Printed circuit boards
Self-assembled monolayers
Mechanical Engineering not elsewhere classified
2010-11-12 14:43:06
Journal contribution
https://repository.lboro.ac.uk/articles/journal_contribution/The_thermal_stability_of_alkanethiol_self-assembled_monolayers_on_copper_for_fluxless_soldering_applications/9561224
The ability of alkanethiol monolayers deposited
on copper to prevent surface oxidation has suggested their
application as preservatives for fluxless soldering. However, the
utility of such coatings for this purpose will critically depend
on their ability to continue to preserve the substrate during
exposure to elevated temperatures throughout the electronics
manufacturing process. Consequently, the aim of this paper is to
systematically determine the effect of storage temperature and
duration on the ability of alkanethiol coated copper samples to
undergo fluxless soldering. Similarly, the effect of pre-heating
copper immediately prior to soldering is also investigated. The
effect of reducing atmospheric oxygen concentration during
storage and soldering is also considered as a potential route
to improve the thermal resilience of the coatings. Parallel to
ascertaining these industrially relevant performance parameters,
a quantitative correlation between surface chemistry and solder
wetting is established, and the temperature dependence of the
kinetics of surface oxidation through an alkanethiol barrier layer
is discussed.