2134/16942
Maria Mirgkizoudi
Maria
Mirgkizoudi
Changqing Liu
Changqing
Liu
Paul Conway
Paul
Conway
Steve Riches
Steve
Riches
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions
Loughborough University
2015
Wire bonding
Reliability testing
High temperature
Vibration
Mechanical Engineering not elsewhere classified
2015-03-10 14:18:55
Journal contribution
https://repository.lboro.ac.uk/articles/journal_contribution/Mechanical_and_electrical_characterisation_of_Au_wire_interconnects_in_electronic_packages_under_the_combined_vibration_and_thermal_testing_conditions/9575411
This paper concerns the reliability of thermosonically bonded 25μm Au wires in the
combined high temperature with vibration conditions, under which the tests have been carried out on
wire bonded 40-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic
packages. Mechanical, optical and electrical analysis has been undertaken in order to identify the
failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in
the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire
during testing. Shear and pull strength levels remained high in general after testing, showing no
significant deterioration due to the test under the combined high temperature and vibration
conditions. However, a trend of the variation in the strength values is identified with respect to the
combined conditions for all wire bonded packages, which may be summarised as: i) increase of the
testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the
mechanical behaviour of the wires is affected due to crystallization that leads to material softening and
consequently the deformation of wire.