2134/13466 Jicheng Gong Jicheng Gong Changqing Liu Changqing Liu Paul Conway Paul Conway Vadim Silberschmidt Vadim Silberschmidt Formation of Ag3Sn plates in SnAgCu solder bumps Loughborough University 2013 Solder Solidification Crystal growth Intermetallics Mechanical Engineering not elsewhere classified Mechanical Engineering 2013-10-31 09:11:19 Journal contribution https://repository.lboro.ac.uk/articles/journal_contribution/Formation_of_Ag3Sn_plates_in_SnAgCu_solder_bumps/9575579 Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag3Sn plates out of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is discussed.