2134/13466
Jicheng Gong
Jicheng
Gong
Changqing Liu
Changqing
Liu
Paul Conway
Paul
Conway
Vadim Silberschmidt
Vadim
Silberschmidt
Formation of Ag3Sn plates in SnAgCu solder bumps
Loughborough University
2013
Solder
Solidification
Crystal growth
Intermetallics
Mechanical Engineering not elsewhere classified
Mechanical Engineering
2013-10-31 09:11:19
Journal contribution
https://repository.lboro.ac.uk/articles/journal_contribution/Formation_of_Ag3Sn_plates_in_SnAgCu_solder_bumps/9575579
Special experiments are designed to obtain the solid reactants directly from a liquid
solder during phase transformation. Series of such tests performed throughout reflow,
which enables to investigate the entire formation process of intermetallic Ag3Sn plates out
of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the
middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is
discussed.