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A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy
journal contribution
posted on 2012-12-17, 10:26 authored by Jung-Sik Kim, Isaac T. Chang, C.L. Falticeanu, G.J. Davies, Kyle JiangA new approach is explored to achieve sintered aluminium alloy from metallic powder mixtures without compression or adding Mg. In this approach, mixtures of micron-sized aluminium powder (average size of 2.5 μm) and nano-sized alloying elemental powder of Cu and Sn (less than of 70nm), at appropriate proportions to compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn with and without adhesive binder were prepared by magnetic stirring. Then, the powder mixture was poured into a crucible and heat treated at a temperature of 600°C for 11 hours in inert atmosphere of N2 or Ar. In this paper, we investigate the debinding behavior of loosely packed Al-based powder mixture and the microstructural development and mechanical property sintered parts using a combination of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), X-ray diffractrometry (XRD) and hardness test.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Citation
KIM, J-S. ... et al, 2007. A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy. IN: Progress in Powder Metallurgy. Proceedings of the 2006 Powder Metallurgy, World Congress & Exhibition (PM 2006), 24th-28th September 2006, Busan, Korea. Trans Tech Publications, vol. 1 pp. 769 - 772Publisher
© Trans Tech PublicationsVersion
- AM (Accepted Manuscript)
Publication date
2007Notes
This is a conference paper. It was published in the series Materials Science Forum and the definitive version is available at: http://www.scientific.net/MSF.534-536.769ISBN
9780878494194ISSN
1662-9752Publisher version
Book series
Materials Science Forum;534-536Language
- en