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A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy

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posted on 17.12.2012 by Jung-Sik Kim, Isaac T. Chang, C.L. Falticeanu, G.J. Davies, Kyle Jiang
A new approach is explored to achieve sintered aluminium alloy from metallic powder mixtures without compression or adding Mg. In this approach, mixtures of micron-sized aluminium powder (average size of 2.5 μm) and nano-sized alloying elemental powder of Cu and Sn (less than of 70nm), at appropriate proportions to compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn with and without adhesive binder were prepared by magnetic stirring. Then, the powder mixture was poured into a crucible and heat treated at a temperature of 600°C for 11 hours in inert atmosphere of N2 or Ar. In this paper, we investigate the debinding behavior of loosely packed Al-based powder mixture and the microstructural development and mechanical property sintered parts using a combination of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), X-ray diffractrometry (XRD) and hardness test.

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Aeronautical and Automotive Engineering

Citation

KIM, J-S. ... et al, 2007. A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy. IN: Progress in Powder Metallurgy. Proceedings of the 2006 Powder Metallurgy, World Congress & Exhibition (PM 2006), 24th-28th September 2006, Busan, Korea. Trans Tech Publications, vol. 1 pp. 769 - 772

Publisher

© Trans Tech Publications

Version

AM (Accepted Manuscript)

Publication date

2007

Notes

This is a conference paper. It was published in the series Materials Science Forum and the definitive version is available at: http://www.scientific.net/MSF.534-536.769

ISBN

9780878494194

ISSN

1662-9752

Publisher version

Book series

Materials Science Forum;534-536

Language

en

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