Kutilainen2019_Article_AtomicLayerDepositionALDToMiti.pdf (2.86 MB)
Atomic layer deposition (ALD) to mitigate tin whisker growth and corrosion issues on printed circuit board assemblies
journal contribution
posted on 2019-09-02, 08:59 authored by Terho Kutilainen, Marko Pudas, Mark Ashworth, Tero Lehto, Liang Wu, Geoffrey Wilcox, Jing Wang, Paul Collander, Jussi HokkaThis paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation.
Funding
The European Space Agency under the European Component Initiative (ECI) Phase 4 and Strategic Initiative (StrIn) programmes (Grant No. 4000113005/14/NL/PA, 2015)
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Materials
Published in
Journal of Electronic MaterialsVolume
48Issue
11Pages
7573 - 7584Publisher
SpringerVersion
- VoR (Version of Record)
Rights holder
© The AuthorsAcceptance date
2019-08-07Publication date
2019-08-23Copyright date
2019ISSN
0361-5235eISSN
1543-186XLanguage
- en
Depositor
Dr Mark AshworthUsage metrics
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