Wang_Corros Sci Manuscript.pdf (2.62 MB)
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing
journal contribution
posted on 2018-09-06, 13:18 authored by Jing Wang, Guang Chen, Fulong Sun, Zhaoxia ZhouZhaoxia Zhou, Zhi-Quan Liu, Changqing Liu© 2018 Elsevier Ltd We report new insights into the solder wettability degradation of Sn thin films on Cu under 155 °C isothermal ageing. A multiscale wettability degradation model was established, reflecting quantitatively the surface oxidation and interfacial intermetallic compound (IMC) growth, on the basis of solder wetting behaviour. The thermal oxidation of Sn exhibited heterogeneous inward thickening, lateral expanding and outward platelet-like growth, forming nanocrystalline, oxygen-deficient SnO2with pronounced voiding/cracking propensity. Unlike a commonly held belief that the initial wettability loss is due to surface-exposing and oxidation of IMCs, it was found from dual combined effects of inward surface oxidation and outward IMC growth.
Funding
This work was supported by Huawei Technologies Ltd., Shenzhen, China [grant number HIPRO20160804].
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
Corrosion ScienceVolume
139Pages
383 - 394Citation
WANG, J. ... et al., 2018. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing. Corrosion Science, 139, pp. 383-394.Publisher
© ElsevierVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2018-05-17Publication date
2018Notes
This paper was accepted for publication in the journal Corrosion Science and the definitive published version is available at Corrosion Science.ISSN
0010-938XPublisher version
Language
- en