Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate

With the continuing increase of the integration density in electronics, dimensions of interconnections for electronic components have been miniaturized to a scale that is comparable to those of their crystallographic structure. For instance, a SnAgCu solder joint in the flip chip package can contain only one or a few grains. In this case, the mechanical behaviour of the micro-joint is expected to shift from a polycrystalline-based to single-crystal one. Considering the further miniaturization, both the crystallographic structure and mechanics of each component (Ag3Sn, Cu6Sn5 and beta-Sn matrix) within a grain and the adjacent SnCu interface will play an important role in the reliability of the micro-joint due to their size comparable with that of a grain, irregular geometry, their heterogeneous distribution and considerably different properties. In addition, at such a small scale, the non-local effect on deformation of beta-Sn should be taken into account to interpret mechanical interactions between components. In this paper, a shearing test, in which it is possible to apply a constant loading to a SnAgCu joint is deigned to investigate mechanics of substructure within a SnAgCu grain and near the SnCu interface.