RC73.pdf (2.16 MB)
Deformation property measurement for single anisotropic conductive adhesive particles
conference contribution
posted on 2009-02-10, 13:12 authored by Guangbin Dou, David Whalley, Changqing LiuAnisotropic Conductive Adhesives (ACAs) consist of a polymer adhesive matrix containing fine conductive
particles. The primary objective of this experimental research was to establish a clearer understanding of
the effects of the bonding force and load rate on the deformation of individual ACA particles. This has been
achieved through measurements of the deformation against force using a specially configured Nano-indenter
machine, where the “indenters”, instead of being a point, had a flat tip 30 μm in diameter. The merit of
using this machine is that very small forces, of the order of 100 mN, can be accurately applied to the
particles to a resolution of 100 nN and the resulting deformations, of less than 6 μm, can then be recorded to
a resolution of 0.1 nm. The results showed that the ACA particle deformation was not linear and the
force/deformation at which particle crushing occurs could be determined from the profile of the force versus
deformation. The crush points and the deformation processes were affected by the load rate.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
DOU, G., WHALLEY, D.C. and LIU, C., 2006. Deformation property measurement for single anisotropic conductive adhesive particles. Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, 5-7th September 2006, vol. 2, pp. 840-847Publisher
© IEEEVersion
- VoR (Version of Record)
Publication date
2006Notes
This is a conference paper [© IEEE]. It is also available from: http://ieeexplore.ieee.org/xpl/RecentCon.jsp?punumber=4060679. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
142440553xLanguage
- en