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Effect of viscoelasticity of EVA encapsulants on photovoltaic module solder joint degradation due to thermomechanical fatigue
journal contribution
posted on 2018-07-13, 11:05 authored by Jiang Zhu, Michael Owen-Bellini, Daniel Montiel-Chicharro, Tom BettsTom Betts, Ralph GottschalgThe solder joint degradation due to thermomechanical fatigue is investigated in this paper
for PV mini-modules with EVA of different viscoelastic properties. The mini-modules were
laminated at different curing temperatures in order to obtain EVA encapsulation with
different viscoelastic properties. The influence of viscoelasticity of EVA on the
thermomechanical fatigue generated on solder joint is analyzed based on a 2D
finite-element model. Based on simulation of thermomechanical stresses accumulation,
mini-modules with EVA cured at lower temperatures accumulated approximately 40%
more stresses during the thermal cycle testing than mini-modules with optimal cured EVA.
The tested mini-modules with EVA cured at lower temperature showed greater power
degradation than the optimal cured mini-modules. An apparent increase in equivalent series
resistance is the primary factor the power loss. A good correlation between the
accumulated thermomechanical fatigue and the increase in equivalent series resistance is
demonstrated with the tested samples.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
Japanese Journal of Applied PhysicsCitation
ZHU, J. ...et al., 2018. Effect of viscoelasticity of EVA encapsulants on photovoltaic module solder joint degradation due to thermomechanical fatigue. Japanese Journal of Applied Physics, 57: 8S3.Publisher
© The Japan Society of Applied Physics. Published by IOP PublishingVersion
- AM (Accepted Manuscript)
Acceptance date
2018-01-01Publication date
2018-07-03Notes
This is an author-created, un-copyedited version of an article published in Japanese Journal of Applied Physics. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.7567/JJAP.57.08RG03.ISSN
0021-4922Publisher version
Language
- en