Liu_JMSE-D-17-00569_R2.pdf (1.21 MB)
Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing
journal contribution
posted on 2019-01-18, 13:37 authored by Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li LiuThe interlayers at solder/pad interface are critical to the reliability of solder joints; hence, their mechanical
properties is of vital importance. However, the correlation
between service duration and evolution of mechanical characteristics of these interlayers has seldom been reported. In
this work, hardness and Young’s moduli of Cu6Sn5, Cu3Sn
and Cu were evaluated by nanoindenation after ageing for
every 100 h up to 500 h. It was found that hardness and
Young’s moduli of Cu6Sn5 and Cu3Sn dropped with aging
and reached the bottom at 200 h and 300 h, respectively, followed by a gradual increase. This U-shape curve was generally opposite to the evolution of corresponding parameters
in Cu. Evolution of mechanical properties of IMCs can be
attributed to constrained volume shrinkage induced by solidstate reactions that producing IMCs. The resultant stress
ultimately affected load–displacement curves recorded by
nanoindentation tests. The observed reverse evolution trend
of examined parameters of Cu and adjacent IMC layers was
a result of mutual constraint posed by Cu3Sn/Cu interface.
Funding
This research was supported by a Marie Curie International Research Staff Exchange Scheme Project within the 7th European Community Framework Programme, No. PIRSESGA-2010-269113, entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6),” the National Natural Science Foundation of China (No: 60976076), and a China-European Union technology cooperation project, No. 1110.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
Journal of Materials Science: Materials in ElectronicsVolume
28Issue
23Pages
17461 - 17467Citation
CHEN, Z. ... et al., 2017. Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing. Journal of Materials Science: Materials in Electronics, 28(23), pp. 17461 - 17467.Publisher
© Springer NatureVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Publication date
2017Notes
This is a post-peer-review, pre-copyedit version of an article published in Journal of Materials Science: Materials in Electronics. The final authenticated version is available online at: https://doi.org/10.1007/s10854-017-7680-1ISSN
0957-4522eISSN
1573-482XPublisher version
Language
- en