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High efficiency nanoparticle solution-processed Cu(In,Ga)(S,Se)2 solar cells

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posted on 23.10.2017 by Alex Eeles, Panagiota Arnou, Jake Bowers, Michael Walls, Stephen Whitelegg, Paul Kirkham, Cary Allen, Stuart Stubbs, Zugang Liu, Ombretta Masala, Christopher Newman, Nigel Pickett
Thin film Cu(In,Ga)(S,Se)2-based (generally referred to as CIGS) solar cells represent a promising alternative to conventional crystalline silicon solar cells due to their high efficiencies, reduced cost and better material utilisation. In recent years it has been demonstrated that it is possible to form thin films by annealing nanoparticulate material such that the nanoparticles coalesce to form large grained thin films. In this paper, we present a 13.8 % efficient CIGS solar cell derived from printed nanoparticle inks. The approach was successfully extended to fabricate monolithic devices on larger substrates. These results demonstrate that low-cost, non-vacuum printing of CIGS nanoparticles has great potential to achieve high efficiencies and reduce the performance gap with the more traditional vacuum co-evaporation and sputtering techniques.

Funding

The Nanoco Technologies authors are grateful for financial support from Innovate UK through an Energy Catalyst grant (no. 102235). The Loughborough University authors are grateful for associated funding by EPSRC through grant EP/N508457/1.

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  • Mechanical, Electrical and Manufacturing Engineering

Published in

IEEE Journal of Photovoltaics

Citation

EELES. A. ...et al., 2018. High efficiency nanoparticle solution-processed Cu(In,Ga)(S,Se)2 solar cells. IEEE Journal of Photovoltaics, 8(1), pp. 288-292.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Version

NA (Not Applicable or Unknown)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution 3.0 Unported Licence (CC BY 3.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by/3.0/

Acceptance date

06/10/2017

Publication date

2018

Notes

This is an Open Access Article. It is published by IEEE under the Creative Commons Attribution 3.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/3.0/

ISSN

2156-3381

Language

en

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