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Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules

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journal contribution
posted on 2017-11-16, 16:22 authored by Michael Owen-Bellini, Daniel Montiel-Chicharro, Jiang Zhu, Tom BettsTom Betts, Ralph Gottschalg
In this work, the mechanical properties of encapsulation materials for photovoltaic modules have been studied. A finite element model has been developed to simulate the degradation of solder bonds within modules subjected to different environmental conditions. Various polymeric encapsulants are characterized using constitutive techniques and included in the model. It is shown that the degradation rates of the solder bonds are dependent on the behavior of the encapsulant and that some encapsulants may cause higher or lower degradation than others depending on the use-environment.

Funding

This work was supported by the STAPP (EP/H040331/1) and JUICE (EP/P003605/1) projects

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

IEEE Journal of Photovoltaics

Issue

99

Citation

OWEN-BELLINI, M. ... et al., 2018. Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules. IEEE Journal of Photovoltaics, 8(1), pp. 183-188.

Publisher

Institute of Electrical and Electronics Engineers

Version

  • AM (Accepted Manuscript)

Publisher statement

Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Acceptance date

2017-09-25

Publication date

2017-11-02

Copyright date

2018

Notes

This article was published in the IEEE Journal of Photovoltaics [© IEEE] and the definitive version is available at: https://doi.org/10.1109/JPHOTOV.2017.2762583

ISSN

2156-3381

Language

  • en