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Investigation of a solder bumping technique for flip-chip interconnection
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posted on 2008-11-07, 16:56 authored by David HuttDavid Hutt, Daniel G. Rhodes, Paul ConwayPaul Conway, Samjid H. Mannan, David WhalleyInvestigation of a solder bumping technique for flip-chip interconnection
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
HUTT, D.A....et al., 1999. Investigation of a solder bumping technique for flip-chip interconnection. IN: 24th International Electronics Manufacturing Technology Symposium, 18-19 Oct., Austin, Texas. pp. 334-342Publisher
© IEEEPublication date
1999Notes
This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
07803-55024Language
- en