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Mechanical properties evaluation for thin film/substrate material systems
journal contribution
posted on 2018-08-01, 13:27 authored by Simon WangSimon Wang, Zhanwei Liu, Christopher HarveyChristopher HarveyMechanical properties evaluation for thin film/substrate material systems
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Published in
Theoretical and Applied Mechanics LettersVolume
8Issue
1Pages
1 - 2Citation
WANG, S., LIU, Z. and HARVEY, C.M., 2018. Mechanical properties evaluation for thin film/substrate material systems. Theoretical and Applied Mechanics Letters, 8 (1), pp.1-2.Publisher
Elsevier on behalf of The Chinese Society of Theoretical and Applied Mechanics © The AuthorsVersion
- VoR (Version of Record)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2018-01-01Publication date
2018-06-30Notes
This is an Open Access Article. It is published by Elsevier under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International Licence (CC BY-NC-ND 4.0). Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/ISSN
2095-0349Publisher version
Language
- en
