181-Bournias-Varotsis.pdf (1.7 MB)
Selectively anodised aluminium foils as an insulating layer for embedding electronic circuitry in a metal matrix via ultrasonic additive manufacturing
conference contribution
posted on 2017-01-12, 10:11 authored by Alkaios Bournias-Varotsis, Ross J. Friel, Russell A. Harris, Daniel EngstromDaniel EngstromUltrasonic Additive Manufacturing (UAM) is a hybrid Additive Manufacturing (AM) process that involves layer-by-layer ultrasonic welding of metal foils and periodic machining to achieve the desired shape. Prior investigative research has demonstrated the potential of UAM for the embedding of electronic circuits inside a metal matrix. In this paper, a new approach for the fabrication of an insulating layer between an aluminium (Al) matrix and embedded electronic interconnections is presented. First, an Anodic Aluminium Oxide (AAO) layer is selectively grown onto the surface of Al foils prior to bonding. The pre-treated foils are then welded onto a UAM
fabricated aluminium substrate. The bonding step can be repeated for the full encapsulation of the electronic interconnections or components. This ceramic AAO insulating layer provides several
advantages over the alternative organic materials used in previous works.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
Solid Freeform Fabrication SymposiumCitation
BOURNIAS-VAROTSIS, A. ... et al, 2016. Selectively anodised aluminium foils as an insulating layer for embedding electronic circuitry in a metal matrix via ultrasonic additive manufacturing. IN: Bourell, D.L. ...et al. (eds.) 27th Annual International Solid Freeform Fabrication (SFF) Symposium– An Additive Manufacturing Conference, Austin, Texas, Aug 8-10th, pp. 2260-2270.Publisher
© the Authors. Published by the Laboratory for Freeform FabricationVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2016-09-08Publication date
2016Notes
This is a conference paper.Publisher version
Language
- en