Thin film properties by blister tests
2018-06-28T10:34:23Z (GMT) by
With the measured geometry morphologies of telephone cord blisters (TCBs), that is, the local blister width and height, and the global wavelength, a mechanical model is built to determine the residual compressive stress in thin films and interface adhesion toughness. This model is based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of TCBs in thin films under the constant residual stress. The model is validated with independent experimental measurements and shows the strong potential to guide the fabrication of micro-patterns on thin films.