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Thin film properties by blister tests

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conference contribution
posted on 28.06.2018 by Simon Wang, Christopher Harvey, Bo Yuan, Gary Critchlow, Rachel Thomson
With the measured geometry morphologies of telephone cord blisters (TCBs), that is, the local blister width and height, and the global wavelength, a mechanical model is built to determine the residual compressive stress in thin films and interface adhesion toughness. This model is based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of TCBs in thin films under the constant residual stress. The model is validated with independent experimental measurements and shows the strong potential to guide the fabrication of micro-patterns on thin films.

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Materials

Published in

ICTAEM 2018: International Conference on Theoretical, Applied and Experimental Mechanics Proceedings of The 2nd International Symposium on Advanced Materials and Engineering Applications

Pages

34 - 38

Citation

WANG, S. ...et al., 2018. Thin film properties by blister tests. IN: Proceedings of The 2nd International Symposium on Advanced Materials and Engineering Applications [International Conference on Theoretical, Applied and Experimental Mechanics 2018], Paphos, Cyprus, June 17-20th, pp. 34-38.

Publisher

Hebei University of Engineering and Loughborough University

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Acceptance date

12/03/2018

Publication date

2018

Notes

This is a conference paper.

Publisher version

Language

en

Location

Paphos, Cyprus

Exports