Thin film properties by blister tests
conference contributionposted on 28.06.2018 by Simon Wang, Christopher Harvey, Bo Yuan, Gary Critchlow, Rachel Thomson
Any type of content contributed to an academic conference, such as papers, presentations, lectures or proceedings.
With the measured geometry morphologies of telephone cord blisters (TCBs), that is, the local blister width and height, and the global wavelength, a mechanical model is built to determine the residual compressive stress in thin films and interface adhesion toughness. This model is based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of TCBs in thin films under the constant residual stress. The model is validated with independent experimental measurements and shows the strong potential to guide the fabrication of micro-patterns on thin films.
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