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Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging

conference contribution
posted on 09.07.2019 by Jing Wang, Zhaoxia Zhou, Wen-Feng Lin, Changqing Liu, Behzad Ahmadi, Lee Empringham
© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm 2 , there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts.

Funding

This work is supported by UK EPSRC Underpinning Power Electronics 2017: Heterogeneous Integration (EP/R004501/1).

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

Citation

WANG, J. ... et al., 2018. Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging. Presented at the 2018 7th Electronic System-Integration Technology Conference, (ESTC 2018), Dresden, Germany, 18-21 Sept.

Publisher

© the Crown. Published by IEEE.

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2018

Notes

This paper is in closed access.

ISBN

9781538668139

Language

en

Exports