File(s) not publicly available
Reason: This item is currently closed access.
Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging
conference contributionposted on 09.07.2019 by Jing Wang, Zhaoxia Zhou, Wen-Feng Lin, Changqing Liu, Behzad Ahmadi, Lee Empringham
Any type of content contributed to an academic conference, such as papers, presentations, lectures or proceedings.
© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm 2 , there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts.
This work is supported by UK EPSRC Underpinning Power Electronics 2017: Heterogeneous Integration (EP/R004501/1).
- Mechanical, Electrical and Manufacturing Engineering