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On reproducing the copper extrusion of through-silicon-vias from the atomic scale

conference contribution
posted on 09.02.2018, 09:31 by Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold, Falk Naumann
Three-dimensional system integration with through-silicon-vias (TSVs) is regarded as a promising solution to the 'More-than-Moore' challenge to improve the performance of micro- and nano-electronic devices. However, the copper extrusion of TSVs during the back-end-of-the-line (BEOL) process and under service conditions poses serious reliability concerns. Substantial experimental and simulation work have been carried out to clarify the origins of copper extrusion, which as yet remain unclear. This study uses a two-mode phase field crystal (PFC) model to reproduce the process of the copper extrusion from the atomic scale. A 'penalty term' is added to the governing equations of the PFC model to simulate the application of a compressive strain to the TSV samples. The application of strain reveals the process of emission and annihilation, and the climb and slip motions of dislocations. In general, the irreversible plastic extrusion is a cumulative effect of the motion of dislocations and the migration of the grain boundaries. The simulation results also suggest that the applied strain rate and the grain structure of the polycrystalline TSVs are important factors controlling the process of copper extrusion.

Funding

The authors acknowledge financial supports from the National Natural Science Foundation of China (NSFC) under grant no. 51004118, the Pearl River Science and Technology Nova Program of Guangzhou under grant no. 2012J2200074, and Guangdong Natural Science Foundation under grant no. 2015A030312011. Financial support from YuxiTech (Guangzhou) Limited is also gratefully acknowledged.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

ICEPT: The 18th International Conference on Electronic Packaging Technology 18th International Conference on Electronic Packaging Technology, ICEPT 2017

Pages

789 - 796

Citation

LIU, J. ... et al, 2017. On reproducing the copper extrusion of through-silicon-vias from the atomic scale. IN: 18th International Conference on Electronic Packaging Technology (ICEPT 2017), Harbin, China, 16-19 August 2017, pp. 789-796.

Publisher

© IEEE

Version

VoR (Version of Record)

Acceptance date

02/04/2017

Publication date

2017

Notes

This paper is closed access.

ISBN

9781538629727

Language

en

Location

Harbin, China

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