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Packaging effects on MEMS pressure sensor hysteresis

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conference contribution
posted on 19.12.2019, 13:42 by Youssef Hamid, David Hutt, David Whalley, Russell Craddock
Micro-electro-mechanical systems (MEMS) have allowed high precision pressure sensors to be manufactured at low cost, but they typically exhibit some level of hysteresis behaviour, which is believed to be primarily due to the materials used to package them. In order to evaluate the effects of the different packaging materials and processes, in this study, the performance of piezoresistive absolute pressure MEMS was measured for each of the first two packaging stages of the product assembly process. Sensing elements first packaged in a “floating exposed” configuration and then in an “attached exposed” configuration were compared. These two different packaging configurations exhibited distinct hysteresis behaviour when thermally cycled. After applying a third order polynomial fit to the raw data, stabilized and moving hysteresis loops were observed for the floating exposed and attached exposed configurations respectively. The stabilized hysteresis is believed to originate from the inelastic behaviour of the die metallisation, whereas the nonstabilized behaviour stems from the adhesive used to attach the die to the housing.

Funding

EPSRC Centre for Doctoral Training in Embedded Intelligence grant number EP/L014998/1.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

Pages

111 - 115

Source

2019 21st Electronics Packaging Technology Conference

Publisher

IEEE

Version

AM (Accepted Manuscript)

Rights holder

© IEEE

Publisher statement

Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Publication date

2020-03-09

Copyright date

2019

ISBN

9781728138350

Language

en

Location

Singapore

Event dates

4th December 2019 - 6th December 2019

Depositor

Mr Youssef Hamid Deposit date: 18 December 2019

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