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The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.

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conference contribution
posted on 25.01.2013 by Baofeng He, Jon Petzing, Patrick Webb, Richard K. Leach, Paul Conway
The micro-electronics industry is investigating glass as an alternative printed circuit board material and interposer. Electroless copper plating of glass is required for tracks and interconnects, but understanding of how the surface topography of the glass substrate affects the mechanics of the copper/glass bond quality is limited. Areal surface texture parameters provide the potential for characterizing key surface features associated with improving copper/glass bonding. Laser ablation techniques have been used to prepare glass surfaces with micro-scale structured features, and these features have been quantified using areal parameters. The copper/glass bond strength has been quantified using scratch testing techniques, with statistical analysis identifying strongly correlating areal parameters that may be used for predictive design of glass surfaces.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

HE, B. ... et al., 2012. The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. IN: Shore, P., Spaan, H. and Burke, T. (eds.) Proceedings of the 12th International Conference of the European Society for Precision Engineering & Nanotechnology, Stockholm, Sweden, 4 - 7 June 2012, Volume 1, pp. 92 - 95.

Publisher

© EUSPEN

Version

AM (Accepted Manuscript)

Publication date

2012

Notes

This extended abstract was accepted for publication in the proceedings of the 12th EUSPEN conference. The publisher's website is at: http://www.euspen.eu/

ISBN

9780956679000

Language

en

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