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The development of post-electroplating surface modification treatments to mitigate tin whisker growth

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conference contribution
posted on 20.07.2016 by Dan Haspel, Mark Ashworth, Geoffrey Wilcox, Roger J. Mortimer
The development of post-electroplating surface modification treatments to mitigate tin whisker growth

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Materials

Published in

Electronic Materials and Processes for Space (EMPS) Workshops, EMPS-7

Citation

HASPEL, D. ... et al., 2016. The development of post-electroplating surface modification treatments to mitigate tin whisker growth. Presented at: Electronic Materials and Processes for Space (EMPS) Workshops, EMPS-7, University of Portsmouth, 13 - 14 April 2016.

Publisher

EMPS

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Acceptance date

10/02/2016

Publication date

2016

Notes

This is a powerpoint presentation.

Language

en

Location

University of Portsmouth

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