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Thin film delamination under in-plane residual stresses

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conference contribution
posted on 29.09.2016 by Christopher Harvey, Simon Wang
Thin film delamination under in-plane residual stresses

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Aeronautical and Automotive Engineering

Published in

2nd International Conference on Mechanics of Composites

Pages

143 - 144

Citation

HARVEY, C.M. and WANG, S., 2016. Thin film delamination under in-plane residual stresses. Presented at the 2nd International Conference on Mechanics of Composites, Universidade do Porto, July 11-14th.

Publisher

© The Authors

Version

AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Acceptance date

28/09/2015

Publication date

2016

Notes

This is a powerpoint presentation entitled "Thin Film Cracking" which was presented at 2nd International Conference on Mechanics of Composites. The abstracts of the papers delivered at the conference were published in: Antonio J.M. Ferreira ...et al. (eds.) 2nd International Conference on Mechanics of Composites, Universidade do Porto, July 11-14th, Bologna: Società Editrice Esculapio, 2016. ISBN 9788874889631 ISSN 2421-2822.

Language

en

Location

Faculdade de Engenharia, Universidade do Porto

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