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Adhesion of aerosol deposition traces targeted for flexible electronics applications

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conference contribution
posted on 20.03.2015, 16:00 authored by Ying Lim, Yee GohYee Goh, Hiroki Tsuda, Jun Akedo, Masahiro Aoyagi, Changqing LiuChangqing Liu
•Emergence of wearable electronics - from medical to consumer products. •Requirement: To realise conductive traces on flexible substrates. •Common printing techniques: screen printing and inkjet printing. •Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition. •From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates. •Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).

Funding

This research was carried out as a collaboration between Loughborough University and AIST. The authors would like to acknowledge the 7th European Community Framework Programme for financial support through a Marie Curie International Research Staff Exchange Scheme (IRSES) Project entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6)” (Grant No. PIRSES-GA-2010-269113).

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D)

Citation

LIM, Y.Y. ... et al, 2014. Adhesion of aerosol deposition traces targeted for flexible electronics applications. Presented at: the Third International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D-2014), 27th-28th August 2014, Ibaraki, Japan.

Publisher

National Institute of Advanced Industrial Science and Technology (AIST)

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2014

Notes

This is a poster presentation.

Language

en

Location

Ibaraki, Japan