Adhesion of aerosol deposition traces targeted for flexible electronics applications
conference contributionposted on 20.03.2015, 16:00 authored by Ying Lim, Yee GohYee Goh, Hiroki Tsuda, Jun Akedo, Masahiro Aoyagi, Changqing LiuChangqing Liu
•Emergence of wearable electronics - from medical to consumer products. •Requirement: To realise conductive traces on flexible substrates. •Common printing techniques: screen printing and inkjet printing. •Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition. •From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates. •Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).
This research was carried out as a collaboration between Loughborough University and AIST. The authors would like to acknowledge the 7th European Community Framework Programme for financial support through a Marie Curie International Research Staff Exchange Scheme (IRSES) Project entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6)” (Grant No. PIRSES-GA-2010-269113).
- Mechanical, Electrical and Manufacturing Engineering