posted on 2015-03-20, 16:00authored byYing Lim, Yee GohYee Goh, Hiroki Tsuda, Jun Akedo, Masahiro Aoyagi, Changqing Liu
•Emergence of wearable electronics - from medical to consumer products.
•Requirement: To realise conductive traces on flexible substrates.
•Common printing techniques: screen printing and inkjet printing.
•Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition.
•From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates.
•Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).
Funding
This research was carried out as a collaboration between Loughborough University and AIST. The authors would like to acknowledge the 7th European Community Framework Programme for financial support through a Marie Curie International Research Staff Exchange Scheme (IRSES) Project entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6)” (Grant No. PIRSES-GA-2010-269113).
History
School
Mechanical, Electrical and Manufacturing Engineering
Published in
International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D)
Citation
LIM, Y.Y. ... et al, 2014. Adhesion of aerosol deposition traces targeted for flexible electronics applications. Presented at: the Third International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D-2014), 27th-28th August 2014, Ibaraki, Japan.
Publisher
National Institute of Advanced Industrial Science and Technology (AIST)
Version
VoR (Version of Record)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/