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Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging
conference contributionposted on 2019-07-09, 11:07 authored by Jing Wang, Zhaoxia ZhouZhaoxia Zhou, Wen-Feng LinWen-Feng Lin, Changqing LiuChangqing Liu, Behzad Ahmadi, Lee Empringham
© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm 2 , there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts.
This work is supported by UK EPSRC Underpinning Power Electronics 2017: Heterogeneous Integration (EP/R004501/1).
- Mechanical, Electrical and Manufacturing Engineering
Published in2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
CitationWANG, J. ... et al., 2018. Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging. Presented at the 2018 7th Electronic System-Integration Technology Conference, (ESTC 2018), Dresden, Germany, 18-21 Sept.
Publisher© the Crown. Published by IEEE.
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Publisher statementThis work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
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