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Deformation property measurement for single anisotropic conductive adhesive particles

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conference contribution
posted on 10.02.2009, 13:12 by Guangbin Dou, David Whalley, Changqing Liu
Anisotropic Conductive Adhesives (ACAs) consist of a polymer adhesive matrix containing fine conductive particles. The primary objective of this experimental research was to establish a clearer understanding of the effects of the bonding force and load rate on the deformation of individual ACA particles. This has been achieved through measurements of the deformation against force using a specially configured Nano-indenter machine, where the “indenters”, instead of being a point, had a flat tip 30 μm in diameter. The merit of using this machine is that very small forces, of the order of 100 mN, can be accurately applied to the particles to a resolution of 100 nN and the resulting deformations, of less than 6 μm, can then be recorded to a resolution of 0.1 nm. The results showed that the ACA particle deformation was not linear and the force/deformation at which particle crushing occurs could be determined from the profile of the force versus deformation. The crush points and the deformation processes were affected by the load rate.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

DOU, G., WHALLEY, D.C. and LIU, C., 2006. Deformation property measurement for single anisotropic conductive adhesive particles. Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, 5-7th September 2006, vol. 2, pp. 840-847

Publisher

© IEEE

Version

VoR (Version of Record)

Publication date

2006

Notes

This is a conference paper [© IEEE]. It is also available from: http://ieeexplore.ieee.org/xpl/RecentCon.jsp?punumber=4060679. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

142440553x

Language

en

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