pressure sensors. A population of 10 experimental unpackaged “floating” bare devices were subjected to pressure and
temperature cycles resulting in a mean hysteresis error of initially 0.062 % of full scale (FS) that reduced to 0.036 %FS after
the third cycle. Within the limited 5 to 65 °C thermal cycles used in this study, this hysteresis is not predicted by the elastic
recovery regime and is attributed to low temperature creep phenomena caused by stresses, that develop as a result of the
coefficient of thermal expansion (CTE) mismatch between the Al-1 %Si bond pads and the Si substrate.
Funding
EPSRC CDT - Embedded Intelligence grant no EP/L014998/1
History
School
Mechanical, Electrical and Manufacturing Engineering
Pages
174-176
Source
Fifth International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2019)
Publisher
IFSA
Version
VoR (Version of Record)
Publisher statement
This is an Open Access Paper. It is published by IFSA under the Creative Commons Attribution 4.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/