7TuPo 10 18.pdf (169.1 kB)
Download file

Effects of different lamination conditions on the reliability of encapsulation materials of pv modules: adhesion strength

Download (169.1 kB)
conference contribution
posted on 04.07.2018, 10:02 by Dan Wu, Jiang Zhu, J. Frese, Daniel Montiel-Chicharro, Tom BettsTom Betts, Ralph Gottschalg
Adhesion strength at different interfaces of the packaging materials of Photovoltaic (PV) modules is an important factor to ensure the long-term reliability and durability of PV modules. The performance of the encapsulation system is expected to be influenced by the lamination processes where temperature, pressure, time and cooling rate are to be controlled. This paper investigates the effects of different lamination temperatures and time on the durability of the packaging materials of PV modules from the viewpoint of adhesion and de-bonding behaviors through damp-heat tests.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

6 World Conference on Photovoltaic Energy Conversion

Citation

WU, D. ... et al., 2014. Effects of different lamination conditions on the reliability of encapsulation materials of pv modules: adhesion strength. Presented at: The 6th World Conference on Photovoltaic Energy Conversion (WCPEC-6), 23rd-27th November 2014, Kyoto, Japan.

Publisher

WCPEC-6

Version

AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2014

Notes

This is a conference paper.

Language

en

Location

Kyoto

Usage metrics

Keywords

Exports