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Effects of different lamination conditions on the reliability of encapsulation materials of pv modules: adhesion strength
conference contributionposted on 2018-07-04, 10:02 authored by Dan Wu, Jiang Zhu, J. Frese, Daniel Montiel-Chicharro, Tom BettsTom Betts, Ralph Gottschalg
Adhesion strength at different interfaces of the packaging materials of Photovoltaic (PV) modules is an important factor to ensure the long-term reliability and durability of PV modules. The performance of the encapsulation system is expected to be influenced by the lamination processes where temperature, pressure, time and cooling rate are to be controlled. This paper investigates the effects of different lamination temperatures and time on the durability of the packaging materials of PV modules from the viewpoint of adhesion and de-bonding behaviors through damp-heat tests.
- Mechanical, Electrical and Manufacturing Engineering
Published in6 World Conference on Photovoltaic Energy Conversion
CitationWU, D. ... et al., 2014. Effects of different lamination conditions on the reliability of encapsulation materials of pv modules: adhesion strength. Presented at: The 6th World Conference on Photovoltaic Energy Conversion (WCPEC-6), 23rd-27th November 2014, Kyoto, Japan.
- AM (Accepted Manuscript)
Publisher statementThis work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
NotesThis is a conference paper.