Effects of different lamination conditions on the reliability of encapsulation materials of pv modules: adhesion strength
conference contributionposted on 04.07.2018, 10:02 authored by Dan Wu, Jiang Zhu, J. Frese, Daniel Montiel-Chicharro, Tom BettsTom Betts, Ralph Gottschalg
Adhesion strength at different interfaces of the packaging materials of Photovoltaic (PV) modules is an important factor to ensure the long-term reliability and durability of PV modules. The performance of the encapsulation system is expected to be influenced by the lamination processes where temperature, pressure, time and cooling rate are to be controlled. This paper investigates the effects of different lamination temperatures and time on the durability of the packaging materials of PV modules from the viewpoint of adhesion and de-bonding behaviors through damp-heat tests.
- Mechanical, Electrical and Manufacturing Engineering