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Further enhancement of thermal conductivity through optimal uses of h-BN fillers in polymer-based thermal interface material for power electronics

conference contribution
posted on 01.04.2020, 10:32 by Han Jiang, Han Zhou, Stuart RobertsonStuart Robertson, Zhaoxia ZhouZhaoxia Zhou, Liguo ZhaoLiguo Zhao, Changqing LiuChangqing Liu
Due to the demand of miniaturization and increasing functionality in power electronics, thermal dissipation becomes a challenging problem for thermal management and reliability. To enable effective heat transfer across the interconnect interfaces, thermal interface materials (TIMs) are required. Electrically insulating TIMs are primarily polymer-based composites which use conductive fillers to enhance thermal conductivity (TC). In this study, the optimal hybrid filler constituents, achieved through mixing spherical and platelet h-BN particles with different ratios, in polymer-based TIM was predicted using finite element (FE) simulations. The underpinning mechanisms of the variation in TC of the TIMs were analyzed from the temperature distribution patterns and micro heat flux paths. Results showed that with the same total volume fraction of h-BN, mixed spherical and platelet h-BN fillers of a certain ratio can further improve the thermal properties of the TIMs compared with those with spherical or platelet h-BN particles alone.

Funding

EPSRC Underpinning Power Electronics 2017 - heterogeneous integration (HI) project (EP/R004501/1)

China Scholarship Council (201806150013)

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering
  • Mechanical, Electrical and Manufacturing Engineering

Department

  • Materials

Published in

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Pages

1569 - 1574

Source

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Publisher

IEEE

Version

VoR (Version of Record)

Rights holder

© IEEE

Publisher statement

© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Publication date

2019-08-26

Copyright date

2019

ISBN

9781728114996

eISSN

2377-5726

Language

en

Location

Las Vegas, NV, USA

Event dates

28th May 2019 - 31st May 2019

Depositor

Dr Han Zhou. Deposit date: 1 April 2020