posted on 2017-03-10, 14:46authored byDarren Cadman, Shiyu Zhang, J. C. Vardaxoglou
Additive Manufacturing, or 3D printing, is
moving from the research labs and into both consumer and commercial manufacturing markets. As the systems, processes and materials available are becoming more mature we are seeing them being tested for new application areas such as electronics. In this paper we review how fused deposition
modelling (FDM) is being explored for creating microwave circuits and componentry, their RF performance and the materials challenges faced. In recent years such microwave circuits and components have included antennas, lenses, antireflective
coatings, transmission lines and planar circuits, waveguide terminations, performing at frequencies ranging from low GHz up to tens of GHz. Additive manufacture of such objects allows new, novel and complex structures to be fabricated with lower impact on the environment relative to current manufacturing processes, plus the rapid prototyping of circuits. Additionally it currently offers reasonable RF performance that can be competitive through further
advances in manufacturing processes and materials.
Funding
This work is supported by the UK’s Engineering and Physical Science Research Council through the grant “Synthesising 3D metamaterials for RF, microwave and
terahertz applications”, SYMETA, grant reference EP/N010493/1.
History
School
Mechanical, Electrical and Manufacturing Engineering
Published in
International symposium on antennas and propagation 2016
Volume
2016 International Symposium on Antennas and Propagation (ISAP)
Pages
418 - 419 (2)
Citation
CADMAN, D., ZHANG, S. and VARDAXOGLOU, J.C., 2016. Fused deposition modelling for microwave circuits & antennas. Presented at the International symposium on antennas and propagation 2016, (ISAP 2016), Okinawa, Japan, Oct 24-26th., pp. 418-419.
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