Euspen 2020 Conference Final Submission.pdf (549.77 kB)

In-situ measurement of electrochemical jet machining using low coherence interferometry

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conference contribution
posted on 29.06.2020, 14:24 by Tom Hovell, Jon Petzing, Laura Justham, Peter Kinnell
The ability to provide surface texturing at the micrometre to millimetre scale is of growing interest in many high-value manufacturing applications, for example, improving a components ability for heat transfer, chemical sensing, wettability and bio-mimicking. Electrochemical Jet Machining (EJM) has shown promise for performing surface structuring, providing material removal via electrochemical dissolution. This gives benefits of being able to machine without introducing stress hardening or thermally affected regions and for processing shear resistant materials. Current quality control processes for EJM involve an offline approach to verify adherence to design tolerances. This requires removal of the part from the machining setup and cleaning which is time consuming and error prone if re-machining is required. Offline approaches do not allow for adaptive control feedback to be implemented during the machining process, which requires an in-situ measurement system. . However, Low Coherence Interferometry (LCI) is a measurement technique that has shown promise for operating in non-ideal environments through its use in biological imaging. Additionally, LCI benefits from easy integration into fibre optic systems allowing for small sensor footprints and has been demonstrated to effectively work in a range of operating mediums. The work presented here investigates the feasibility of applying a fully fibre enclosed common-path LCI sensor within EJM.

Funding

UK Engineering Physical Science and Research Council (EPSRC) (EP/R513088/1)

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Proceedings of the 20th International conference of the European Society for Precision Engineering and Nanotechnology (euspen)

Source

euspen’s 20th International Conference & Exhibition

Publisher

euspen

Version

AM (Accepted Manuscript)

Rights holder

© euspen

Acceptance date

02/03/2020

Publication date

2020-06-08

Notes

The 20th euspen conference was planned to be held in Geneva and CERN, Switzerland, during 8-12 June 2020. In light with the COVID’19 pandemic, changes were made to the format of the conference. It was decided to deliver euspen 2020 conference as a “virtual online web-conference”.

Language

en

Location

Geneva, Switzerland (Virtual Conference)

Event dates

8th June 2020 - 11th June 2020

Depositor

Dr Jon Petzing. Deposit date: 26 June 2020

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