p254 WU, HUTT et al.pdf (1.71 MB)

Laser processing of printed copper interconnects on polymer substrates

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conference contribution
posted on 05.01.2017, 10:45 by Kang Wu, Shuai Hou, Siyuan Qi, David Hutt, John Tyrer, David Whalley
With the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive polymers, that may also have non-planar surfaces. In this work, micron scale copper powder based materials were deposited onto acrylic and glass substrates and then selectively laser processed to form electrically conductive copper tracks. Before deposition, the copper powder was chemically treated to remove the surface oxide and subsequently protected with a self-assembled monolayer coating. The copper was then patterned onto the substrate either as a dry powder confined within pre-formed grooves, or was combined with a binder to be printed as a paste. A CO2 laser was then used to heat the copper powder in air, leading to tracks that showed good electrical conductivity. At low laser power levels, the tracks appeared largely unchanged from the original material, but showed measureable conductivity. With higher laser power levels the tracks showed evidence of partial melting of the surface layers and further reductions in resistivity, to values approximately 30 times those of bulk copper, were obtained.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Electronics Packaging Technology Conference (EPTC)

Pages

834 - 839

Citation

WU, K. ... et al, 2017. Laser processing of printed copper interconnects on polymer substrates. Presented at the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Singapore, 30th November - 3rd December 2016, pp. 834-839.

Publisher

© IEEE

Version

AM (Accepted Manuscript)

Acceptance date

11/10/2016

Publication date

2017

Notes

© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

ISBN

9781509043699

Language

en

Location

Singapore

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