p254 WU, HUTT et al.pdf (1.71 MB)
Laser processing of printed copper interconnects on polymer substrates
conference contribution
posted on 2017-01-05, 10:45 authored by Kang Wu, Shuai Hou, Siyuan Qi, David HuttDavid Hutt, John TyrerJohn Tyrer, David WhalleyWith the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive polymers, that may also have non-planar surfaces. In this work, micron scale copper powder based materials were deposited onto acrylic and glass substrates and then selectively laser processed to form electrically conductive copper tracks. Before deposition, the copper powder was chemically treated to remove the surface oxide and subsequently protected with a self-assembled monolayer coating. The copper was then patterned onto the substrate either as a dry powder confined within pre-formed grooves, or was combined with a binder to be printed as a paste. A CO2 laser was then used to heat the copper powder in air, leading to tracks that showed good electrical conductivity. At low laser power levels, the tracks appeared largely unchanged from the original material, but showed measureable conductivity. With higher laser power levels the tracks showed evidence of partial melting of the surface layers and further reductions in resistivity, to values approximately 30 times those of bulk copper, were obtained.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
Electronics Packaging Technology Conference (EPTC)Pages
834 - 839Citation
WU, K. ... et al, 2017. Laser processing of printed copper interconnects on polymer substrates. Presented at the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Singapore, 30th November - 3rd December 2016, pp. 834-839.Publisher
© IEEEVersion
- AM (Accepted Manuscript)
Acceptance date
2016-10-11Publication date
2017Notes
© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.ISBN
9781509043699Publisher version
Language
- en