Non-destructive defect detection for MEMS devices using transient thermography
conference contribution
posted on 2018-07-17, 08:44 authored by Xiaoting Wang, David Whalley, Vadim SilberschmidtVadim SilberschmidtThis paper investigates the use of transient infrared thermography in a transmission mode for subsurface defect detection within thin multilayer structures such as those found in MEMS devices. This was undertaken through the use of finite element analysis based simulations for several sizes of defects and for several combinations of substrate and thin film materials. The maximum temperature difference observable at the sample surface between defective and non-defective regions of the sample was investigated as a function of various parameters of the sample materials and defect geometry.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
2016 6th Electronic System-Integration Technology Conference (ESTC) 2016 6th Electronic System-Integration Technology Conference, ESTC 2016Citation
WANG, X., WHALLEY, D.C. and SILBERSCHMIDT, V.V., 2016. Non-destructive defect detection for MEMS devices using transient thermography. Presented at the 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, France, 13-15 September 2016.Publisher
© IEEEVersion
- AM (Accepted Manuscript)
Acceptance date
2016-09-01Publication date
2016Notes
© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.ISBN
9781509014026Publisher version
Language
- en
