posted on 2019-05-14, 11:52authored byJinxin Liu, Zhiheng Huang, Paul ConwayPaul Conway, Yang Liu
A phase-field-crystal (PFC) model is used to investigate the protrusion of blind TSVs under different strain states. The direction of loading applied to the TSVs has an effect on the protrusion, which is closely related to the copper grains and their orientations at the TSV edges. A nonlinear relation between protrusion and strain rate has been found, which can be explained by different mechanisms of deformation. A higher strain occurring near the top end of the TSVs leads to a larger protrusion of the bind TSVs.
Funding
National Natural Science Foundation of China (NSFC) under grants 51832002, the Guangdong Natural Science Foundation under grant 2015A030312011, and the Zhuhai Key
Technology Laboratory of Wide Bandgap Semiconductor Power Electronics under grant 20167612042080001.
History
School
Mechanical, Electrical and Manufacturing Engineering
Published in
EMAP 2018
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
Citation
LIU, J. ... et al, 2019. Protrusion of Cu-TSV under different strain states. Presented at the 2018 20th International Conference on Electronic Materials and Packaging (EMAP), Hong Kong, 17-20 December 2018.