posted on 2015-03-23, 13:38authored byYing Lim, Yee GohYee Goh, Manuba Yoshida, Tung T. Bui, Tracy Vincent, Masahiro Aoyagi, Changqing Liu
In this paper, the authors investigate the influence of DC
conductivity on the RF performance of screen printed traces
on a flexible substrate. From literature, much work has been
done on the effect of sintering conditions on the electrical
resistivity of printed traces. Typically the traces were printed
onto substrates with negligible surface roughness. Yet this
would not be the case for printing on textiles for wearable
electronics applications. In this paper, we investigate the
electrical resistivity of screen printed traces on a substrate
which is similar to fabrics, in that it is flexible and has nonnegligible
surface roughness (Ra~1μm). In particular, an
accurate simulation model was developed to correlate with the
measurement results, which would provide guidelines for the
modelling of similar printed traces to predict their RF
performances.
Funding
The authors are grateful to Rogers Corporation for the
generous provision of the RO3006TM laminates. In addition,
they are indebted to Computer Simulation Technology (CST)
for the provision of the software license for this work. Lastly,
the authors would like to acknowledge the 7th European
Community Framework Programme for financial support
through a Marie Curie International Research Staff Exchange
Scheme (IRSES) Project entitled “Micro-Multi-Material
Manufacture to Enable Multifunctional Miniaturised Devices
(M6)” (Grant No. PIRSES-GA-2010-269113). A part of this
work was conducted at the AIST Nano-Processing Facility
and NIMS Nanofabrication Platform, supported by
"Nanotechnology Platform Program" of the Ministry of
Education, Culture, Sports, Science and Technology (MEXT),
Japan.
History
School
Mechanical, Electrical and Manufacturing Engineering
LIM, Y.Y. ... et al, 2014. Silver screen printed transmission lines- influence of substrate porosity on the RF performance and modelling up to 30GHz. IN: The Proceedings of the 2014 IEEE 16th Electronics Packaging Technology Conference - (EPTC 2014), 3rd-5th December 2014, Singapore, pp. 22-26.
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