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The role of EVA encapsulation in the degradation of wafer based PV modules

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conference contribution
posted on 09.04.2018, 13:37 by Jiang Zhu, Daniel Montiel-Chicharro, Michael Owen-Bellini, Tom BettsTom Betts, Ralph Gottschalg
This paper investigates the effects of ethylene vinyl acetate (EVA) encapsulation on PV module ageing and how crosslinking degree of encapsulation influences module durability under damp-heat (DH) and thermal cycle (TC) stresses. Results show that the high crosslinking samples favoured TC stresses, while the low crosslinking samples performed better under DH stresses. The primary mechanism of DH-induced degradation is series resistance (RS) increase and parallel resistance (RP) decrease due to moisture ingress and grid/contact corrosion. Comparison analysis of the result indicates that the lower cross-linked EVA appeared to be able to accommodate a smaller amount of the generated acetic acid and thus resulted in a lower corrosion rate. The primary effect of TC is to impose thermal expansion/compression on device. The EVA with lower crosslinking degree is less compact and the freedom of motion of EVA macromolecules is higher, which appeared to be less resistant to the effect of expansion/compression

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

12 PVSAT

Citation

ZHU, J. ...et al., 2016. The role of EVA encapsulation in the degradation of wafer based PV modules. IN: Hutchins, M., Treharne, R. and Cole, A. (eds.) 12th Photovoltaic Science, Application and Technology Conference C98 (PVSAT-12), University of Liverpool, 6-8th April.

Publisher

© The Solar Energy Society

Version

AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Acceptance date

08/04/2016

Publication date

2016

Notes

This is a conference paper.

ISBN

0904963829

Publisher version

Language

en

Location

Liverpool

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