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Download fileThermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints
conference contribution
posted on 2009-02-11, 16:03 authored by Pradeep Hegde, David Whalley, Vadim SilberschmidtVadim SilberschmidtIt is well known that in surface mount technology
(SMT), thermal strains in electronic assemblies are
induced in the solder joints by the mismatch between the
coefficients of thermal expansion (CTE) of the
components, substrate and solder, both during their
processing and in service. Therefore, thermo-mechanical
damage is likely to occur in the solder and the principle
reliability hazard in SMT assemblies is the resulting
fatigue cracking of the solder fillet, caused by cyclic
thermal stresses. These stresses may be caused by both
cyclic variations in power dissipation within equipment
and by external environmental temperature changes. Most
work reported to date has focused on the effects of
environmental temperature changes, although for many
types of equipment power cycling may result in
significant stresses. The present paper describes the
experimental determination of the actual temperature
distribution in a chip resistor assembly when it is
powered. The paper also discusses the significance of
such experimentally determined non-uniform temperature
distributions in electronic assemblies to fatigue damage
accumulation due to both power cycling and to cyclic
variations in the ambient temperature whilst the chip
resistor is powered. This fatigue damage accumulation
study is carried out using finite element analysis.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
HEDGE, P., WHALLEY, D.C. and SILBERSCHMIDT, V.V., 2008. Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints. IN: Proceedings, 2nd IEEE Electronics Systemintegration Technology Conference, Greenwich, 1-4 Sept. 2008, pp. 1081 - 1090Publisher
© IEEEVersion
- VoR (Version of Record)
Publication date
2008Notes
This is a conference paper [© IEEE]. It is also available from: http://ieeexplore.ieee.org/servlet/opac?punumber=4658784. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
9781424428137Language
- en