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Thin film delamination under in-plane residual stresses
conference contribution
posted on 2016-09-29, 13:29 authored by Christopher HarveyChristopher Harvey, Simon WangSimon WangThin film delamination under in-plane residual stresses
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Published in
2nd International Conference on Mechanics of CompositesPages
143 - 144Citation
HARVEY, C.M. and WANG, S., 2016. Thin film delamination under in-plane residual stresses. Presented at the 2nd International Conference on Mechanics of Composites, Universidade do Porto, July 11-14th.Publisher
© The AuthorsVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2015-09-28Publication date
2016Notes
This is a powerpoint presentation entitled "Thin Film Cracking" which was presented at 2nd International Conference on Mechanics of Composites. The abstracts of the papers delivered at the conference were published in: Antonio J.M. Ferreira ...et al. (eds.) 2nd International Conference on Mechanics of Composites, Universidade do Porto, July 11-14th, Bologna: Società Editrice Esculapio, 2016. ISBN 9788874889631 ISSN 2421-2822.Publisher version
Language
- en
