Harvey_Thin film properties by blister tests.pdf (311.94 kB)
Thin film properties by blister tests
conference contribution
posted on 2018-06-28, 10:34 authored by Simon WangSimon Wang, Christopher HarveyChristopher Harvey, Bo Yuan, Gary Critchlow, Rachel ThomsonRachel ThomsonWith the measured geometry morphologies of telephone cord blisters (TCBs), that is, the local blister width and height, and the global wavelength, a mechanical model is built to determine the residual compressive stress in thin films and interface adhesion toughness. This model is based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of TCBs in thin films under the constant residual stress. The model is validated with independent experimental measurements and shows the strong potential to guide the fabrication of micro-patterns on thin films.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Materials
Published in
ICTAEM 2018: International Conference on Theoretical, Applied and Experimental Mechanics Proceedings of The 2nd International Symposium on Advanced Materials and Engineering ApplicationsPages
34 - 38Citation
WANG, S. ...et al., 2018. Thin film properties by blister tests. IN: Proceedings of The 2nd International Symposium on Advanced Materials and Engineering Applications [International Conference on Theoretical, Applied and Experimental Mechanics 2018], Paphos, Cyprus, June 17-20th, pp. 34-38.Publisher
Hebei University of Engineering and Loughborough UniversityVersion
- VoR (Version of Record)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2018-03-12Publication date
2018Notes
This is a conference paper.Publisher version
Language
- en