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Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory

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journal contribution
posted on 22.10.2008, 10:20 by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams
This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array ( BGA) chip scale packaging (CSP) and also flip-chip and conventional ball grid array (BGA) package structures. The paper presents the results of computational fluid dynamics (CFD) models of the early stages of the assembly process when the adhesive is squeezed out between the device and the substrate. Experimental results on the assembly trials are presented in an accompanying paper [1] and have been previously reported at the Adhesives in Electronics Conference, Gothenburg, 1996 [2]. The CFD models outlined here show how those results might be expected to change for smaller pitches.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

MANNAN, S. H. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 264-269

Publisher

© Institute of Electrical and Electronics Engineers (IEEE)

Publication date

1996

Notes

This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technology - Part C [© IEEE], and is available from: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 . Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISSN

1083-4400

Language

en

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