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Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

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journal contribution
posted on 08.05.2015 by Yuanming Chen, Jianhui Lin, Tianyang Qiu, Wei He, Vadim Silberschmidt, Shouxu Wang, Ze Tan
Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.

Funding

The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (No. 201301C0105324342), National Natural Science Foundation of China (No. 61474019) and Ph.D. Programs Foundation of Ministry of Education of China (No. 20120185110021), and we also express our sincere thanks to the support of China Scholarship Council (No. 201306070032).

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

MATERIALS LETTERS

Volume

139

Pages

458 - 461 (4)

Citation

CHEN, Y. ... et al, 2015. Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition. Materials Letters, 139, pp. 458 - 461.

Publisher

© Elsevier

Version

AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2015

Notes

This paper was accepted for publication in the journal Materials Letters and the definitive published version is available at http://dx.doi.org/10.1016/j.matlet.2014.10.080.

ISSN

0167-577X

Language

en

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