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Determination of residual stress and interface adhesion toughness of thin films by blisters

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journal contribution
posted on 01.04.2019 by Bo Yuan, Christopher Harvey, Gary W. Critchlow, Rachel Thomson, Simon Wang
Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films under constant bi-axial compressive residual stress. In this work, new mechanical models are used in conjunction with measurements of blister morphology parameters to determine the residual stress in films and the adhesion toughness at interfaces. These new models are based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of blisters instead of buckling, as in the conventional models, since the thin films are under constant compressive residual stress. Predictions from the models are in excellent agreement with independent experimental data.

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Aeronautical and Automotive Engineering

Published in

Material Design and Processing Communication

Volume

1

Issue

5

Citation

YUAN, B. ... et al., 2019. Determination of residual stress and interface adhesion toughness of thin films by blisters. Material Design and Processing Communication, 1 (5), e60.

Publisher

© Wiley

Version

AM (Accepted Manuscript)

Publisher statement

This is the peer reviewed version of the following article: YUAN, B. ... et al., 2019. Determination of residual stress and interface adhesion toughness of thin films by blisters. Material Design and Processing Communication, 1 (5), e60, which has been published in final form at https://doi.org/10.1002/mdp2.60. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.

Acceptance date

20/03/2019

Publication date

2019-04-02

ISSN

2577-6576

Language

en

Article number

e60

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