Determination of residual stress and interface adhesion toughness of thin films by blisters
journal contributionposted on 01.04.2019 by Bo Yuan, Christopher Harvey, Gary W. Critchlow, Rachel Thomson, Simon Wang
Any type of content formally published in an academic journal, usually following a peer-review process.
Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films under constant bi-axial compressive residual stress. In this work, new mechanical models are used in conjunction with measurements of blister morphology parameters to determine the residual stress in films and the adhesion toughness at interfaces. These new models are based on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and growth of blisters instead of buckling, as in the conventional models, since the thin films are under constant compressive residual stress. Predictions from the models are in excellent agreement with independent experimental data.
- Aeronautical, Automotive, Chemical and Materials Engineering
- Aeronautical and Automotive Engineering