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Formation of Ag3Sn plates in SnAgCu solder bumps

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journal contribution
posted on 31.10.2013 by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt
Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag3Sn plates out of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is discussed.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

GONG, J. ... et al, 2010. Formation of Ag3Sn plates in SnAgCu solder bumps. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 527 (10-11), pp.2588-2591.

Publisher

© Elsevier

Version

AM (Accepted Manuscript)

Publication date

2010

Notes

This is the author’s version of a work that was accepted for publication in Materials Science and Engineering A. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.msea.2009.12.020

ISSN

0921-5093

Language

en

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